0603ESDA-TR , polysurg? tr series esd suppressor p art ratings and characteristics: performance characteristics units min typ max continuous operating voltage vdc - - 24 clamping v oltage 2 v - 35 60 trigger voltage 3 v - 125 - esd threat v oltage capability 4 kv - 815 capacitance (@ 1 khz ~ 1.8ghz) pf - - 0.15 leakage current (@ 12 vdc) na 0.01 <0.1 - peak current 2 a - 30 45 oper ating temper ature c -56 +25 +105 esd pulse withstand 2 # pulses 20 >500 1 - notes: 1. some shifting in characteristics may occur when tested over several hundred esd pulses at very rapid rate of 1 pulse per second or faster. 2. per iec 61000-4-2, 30a @ 8kv, level 4, clamp measurement made 30ns after initiation of pulse, all tests in contact discharge mode. 3. trigger measurement made using transmission line pulse (tlp) method 4. polysurg? devices are capable of withstanding up to a 15 kv, 45a esd pulse. device ratings are given at 8kv per note 1, unless otherwise specified. features: ? 0603/1608 foot print ? ideal esd protection for high frequency, low voltage applications. ? exceeds testing requirements outlined in iec 61000-4-2 ? ultra low capacitance (0.15pf maximum) ? very low leakage current ? fast response time ? bi-directional ? surface mount ? computers & peripherals ? hdtv equipment ? dvd players ? a/v equipment ? satellite radio ? cell phones ? pdas ? digital still camer as ? digital camcorders ? mp3 / multimedia players ? set top boxes ? external storage ? dsl modems ? high speed data ports ? usb 2.0 ? ieee 1394 ? hdmi ? dvi ? high speed ethernet ? infiniband ? applications the p olysurg ? 0603esd a-tr esd suppressors protect v aluab le high-speed data circuits from esd damage without distorting data signals as a result of its ultr a-lo w (0.15pf maxim um) capacitance . description ordering information catalog number packaging 0603ESDA-TR1 5,000 pieces in paper tape on 7" (178mm) reel
0603ESDA-TR , polysurg? tr series esd suppressor w l h t r 1.0 max (.039 max) 1.1 ref (.043 ref) 0.60 min (.023 min) mm (inches) recommended solder pad outline ( per ipc-sm-782) 4.0 0.1 (.157?004) 4.0?.1 (.157 .004) 2.0?.05 (.079 .002) 8.0?.30 (.315?012) 1.5?.10 (.059 .004) 1.75?.1 (.069 ?004) 13.0 ?.5 (.512?020) 9.0?.5 (.354?059) 178.0?.0 (7.008 .080) 21?.8 (.827 .032) 2.0 0.5 (.080?020) b a 3.5?.05 (.138 .002) 60.0?.5 (2.362?059) 2.0 0.75 (.079 ?030) dimension a b 0603 1.90?.20 (.075?.008) 1.10 0.20 (.043?.008) product dimension tape-and-reel specification eia size l w h t r mm (in) 0603esda 1.60 0.10 0.80 0.10 0.50 0.10 0.30 0.20 0.70 0.10 (.063 .004) (.031 .004) (.020 .004) (.012 .008) (.028 .004) en vir onmental specifications: ? moisture resistance per eia/is-722 paragraph 4.4.2. this standard is based upon mil-std-202g method 103b but with tem- per ature and relativ e humidity at +85 and 85% rh respectively. test condition (240hr) per mil-std-202g ? thermal shock: mil-std-202, method 107g, -55c to 125c, 30 min. cycle, 10 cycles ? vibration: mil-std-202f, method 201a,(10 to 55 to 10 hz, 1 min. cycle, 2 hrs each in x-y-z) ? chemical resistance: astm d-543, 4 hrs @ 40, 3 solutions (h2o, detergent solution, defluxer) ? oper ating temper ature char acter istics, measurement at +25, +105 and --6? ? full load voltage: 14.4vdc, 18vdc & 24vdc for 1000 hrs, 25 ? solder leach resistance and terminal adhesion: per eia-576 ? solderability: mil-std-202, method 208 (95% coverage)
0603ESDA-TR , polysurg? tr series esd suppressor device marking e sda devices are marked on the tape and reel packages, not individually. since the product is bi-directional and symmetrical, no orientation marking is required. design consideration the location in the circuit for the tr series has to be carefully determined. for better performance, the device should be placed as close to the signal input as possible and ahead of any other component. due to the high current associated with an esd e vent, it is recommended to use a --tub pad design (pad directly on the signal/data line and second pad directly on common ground). processing recommendations the tr series currently has a convex profile on the top surface of the part. this profile is a result of the construction of the deice. they can be processed using standard pick-and-place equipment. the placement and processing techniques for these devices are similar to those used for chip resistors and chip capacitors. visit us on the web at www.cooperbussmann.com sales@cooperbussmann.com 1225 brok en sound pkwy . nw, suite f boca raton, florida 33487 tel: +1-561-998-4100 toll free: +1-888-414-2645 fax: +1-561-241-6640 0603 7/05 cooper electr onic technologies 2005 soldering recommendations ? compatib le with lead and lead-free solder reflow processes ? peak reflow temperatures and durations: ? ir reflow = 260 max for 10 sec. max. ? w a v e solder = 260 max. for 10 sec. max. ? recommended ir reflow profile:
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